Technology Capabilities
| Technology Capabilities (process) |
 |
SMT & PTH |
|
Chip On Board/Flex (COB) |
|
Electro-Mechanical & Box-Build Assembly |
|
Clean & No-Clean Processes |
|
Lead Free/Leaded Process Capabilities |
|
BGA Repair/Rework Capability |
|
Automatic Optical Inspection (AOI) |
|
X-Ray Inspection (2DX, 5DX) |
| |
|
| Technology Capabilities (components) |
|
CCGA, Micro-BGA, CSP |
|
Component count > 3,000 |
|
Number of joints > 10,000 |
|
QFP (16mil pitch) |
|
PCB Layer count of up to 8 layers |
| Technology Capabilities (Test) |
| A) |
Shield Room |
| B) |
Shielded Enclosure For RF Testing |
Technology Capabilities (Test/ inspection)
 |
 |
 |
SMT Feeder Calibration
Tools Genitec - GAM - 20J |
Agilent Technology
Medalist 5DX Series
5000 X Ray |
Inline AOI Machine
Saki - BF Frontier |
 |
 |
 |
Glenbrook Technology
Real-Time X-Ray
Workstation |
Desktop AOI Machine
Saki AOI-BF18D-P40 |
3D Solder Paste
Inspection Machine
Cyber Optics Sentry SE200 |
 |
 |
 |
Solder Paste
Thickness Checker
CyberOptics - LSM |
40 x 3D Vision
Inspection Machine
Vision Engineering VS7 |
400 x Videoscope
Scalar VL-11S |
|
